Author:
Guo Ming-Yung,Lin C.K.,Chen Chih,Tu K.N.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
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4. Thermomigration in SnPb composite flip chip solder joints;Huang;Appl Phys Lett,2006
5. Thermomigration in Pb-free SnAg solder joint under alternating current stressing;Hsiao;Appl Phys Lett,2009
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