Temperature effects on liquid-state Sn/Co interfacial reactions-Reference-Cited by-同舟云学术

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Temperature effects on liquid-state Sn/Co interfacial reactions

Published:2013-01 Issue: Volume:32 Page:57-63
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Wang Chao-hong,Kuo Chun-yi,Huang Sheng-en,Li Po-yi

Funder

National Science Council of Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference25 articles.

1. Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate;Wang;Intermetallics,2010

2. Size and substrate effects upon undercooling of Pb-free solders;Huang;Journal of Electronic Materials,2010

3. Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni;Yang;Journal of Alloys and Compounds,2010

4. Co solubility in Sn and interfacial reaction in Sn–Co/Ni couples;Chen;Journal of Electronic Materials,2010

5. Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates;Yen;Journal of Alloys and Compounds,2010

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications;Electronics;2024-06-03

2. The phases formed in Sn/Co thin bilayer upon heating;Journal of Solid State Chemistry;2024-06

3. Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions;Electronic Materials Letters;2024-04-13

4. Effects of electrodeposited Co–W and Co–Fe–W diffusion barrier layers on the evolution of Sn/Cu interface;Materials Chemistry and Physics;2024-02

5. Stacking-disordered CoSn3 and tetragonally stacked CoSn4 formed during solid-state interdiffusion of Co and Sn;Intermetallics;2023-09

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