Kinetics of intrinsic stress in nanocrystalline films

Author:

Vasco EnriqueORCID,Ramírez-Peral María J.,Jacas-Rodríguez Alfredo,Polop CeliaORCID

Funder

Comunidad de Madrid

Ministerio de Ciencia, Innovación y Universidades

Ministerio de Ciencia e Innovación

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference20 articles.

1. Review Article: Stress in thin films and coatings: Current status, challenges, and prospects

2. Conditions of high atomic transport Φ=Dsn1/kBT imply both a high concentration n1 of the mobile species and high diffusive mobilities Ds/kBT, where Ds is the diffusion coefficient. These conditions are reached from moderate T/Tmelting using external sources of diffusing adatoms (e.g., thermal fluxes), and/or processes generating mobile species via massive detachment (e.g., annealing giving rise to recrystallizations, energy ion bombardment).

3. A unified kinetic model for stress relaxation and recovery during and after growth interruptions in polycrystalline thin films

4. Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions

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