Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions-Reference-Cited by-同舟云学术

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Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions

Published:2007-04 Issue:8 Volume:56 Page:661-664
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Yoon Jeong-Won,Chun Hyun-Suk,Koo Ja-Myeong,Lee Hoo-Jeong,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference22 articles.

1. Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies;Lau,2000

2. Fluxless flip–chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films

3. Microstructure and preferred orientation of Au–Sn alloy plated deposits

4. Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films

5. Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging

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1. Dual-cluster interpretation of Au–Sn binary eutectics and solders;AIP Advances;2024-03-01

2. Effect of the Second-Phase Particle Distribution on the Brittle Fracture Behavior of Sn-3Ag-0.5Cu Solder;Journal of Electronic Materials;2023-03-07

3. Effect of the Second-Phase Particles Distribution on the Brittle Fracture Behavior of Sn-3ag-0.5cu Solder;SSRN Electronic Journal;2022

4. Synergistic size and shape effect of dendritic silver nanostructures for low-temperature sintering of paste as die attach materials;Journal of Materials Science: Materials in Electronics;2021-01

5. Effect of Electromigration-Induced Joule Heating on the Reliability of Sn-Ag Microbump with Different UBM Structures;Journal of Electronic Materials;2020-10-22

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