Author:
Han Bangyao,Sun Fenglian,Li Tianhui,Liu Yang
Abstract
PurposeThe purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni solder joint during the high temperature aging.Design/methodology/approachSn-5Sb-1Cu-0.1Ni-0.1Ag solder balls (500 µm in diameter), heat sink with structure of 7.4 µm Au layer on 5 µm Ni-plated Cu alloy and Si chip with 5.16 µm plated Au were used to fabricate micro-solder joints. The joints were performed in a furnace at 150°C for 150, 250 and 350 h aging. The samples were polished and deep etched before analyzed by metallographic microscope and scanning electron microscopy, respectively. Energy dispersive x-ray spectroscopy was used to identify the composition of the IMCs.Findingsß-(Au,Ni,Cu)10Sn phase is formed during the soldering process. The IMCs evolution has two periods during the aging. The first is theξ-(Au,Ni,Cu)5Sn,ξ-(Au,Cu)5Sn andδ-AuSn were formed and grew to form a full-compound joint after about 150 h aging. The second is the conversion of the full-compound joint. The IMCs converted toξ′ phase when the aging time extends to 250 h, and transformed toε-(Au,Ni,Cu)Sn2andη-(Au,Ni,Cu)Sn4after 350 h aging. The thicker gold layer and thinner solder joint can promote the growth of the IMCs.ß-(Au,Ni,Cu)10Sn emerged in Au/SnSb-CuNiAg/(Au)Ni in this research, which is not usually found.Originality/valueThe results in this study have a significant meaning for the application of the new Sn-5Sb-1Cu-0.1Ni-0.1Ag in harsh conditions.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Enhanced lateral heat dissipation packaging structure for gan hemts on Si substrate;Applied Thermal Engineering,2013
2. Mechanical properties of intermetallic compounds in the Au-Sn system;Journal of Materials Research,2005
3. Anti-aging performance of Au20Sn/Au micro solder joints;Electronic Components & Materials,2017
4. First principles study of Au-Sn intermetallic compounds;Acta Physica Sinica,2013
5. Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder,2006
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