The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils-Reference-Cited by-同舟云学术

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The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils

Published:2008-01 Issue:1 Volume:58 Page:65-68
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Yin K.B.,Xia Y.D.,Chan C.Y.,Zhang W.Q.,Wang Q.J.,Zhao X.N.,Li A.D.,Liu Z.G.,Bayes M.W.,Yee K.W.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference26 articles.

1. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature

2. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

3. Texture development of blanket electroplated copper films

4. In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films

5. The Effect of Plating Current Densities on Self-Annealing Behaviors of Electroplated Copper Films

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2. Measurement of Shear Strengths of Cu Films Using Precise Chip Forming;Materials;2022-01-26

3. Process and theoretical research on electroplating Cu–Sn alloys of low Sn;Journal of Applied Electrochemistry;2021-06-10

4. Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing;Journal of Alloys and Compounds;2020-12

5. Investigation of biphasic calcium phosphate (BCp)/polyvinylpyrrolidone (PVp) /graphene oxide (GO) composite for biomedical implants;Ceramics International;2020-10

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