Texture development of blanket electroplated copper films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.372166
Reference21 articles.
1. Damascene copper electroplating for chip interconnections
2. Electrodeposition of metals and alloys—new results and perspectives
3. The Structure of Electroplated and Vapor‐Deposited Copper Films
4. The Structure of Electrodeposited Copper Examined by X-Ray Diffraction Techniques
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