Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing-Reference-Cited by-同舟云学术

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Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing

Published:2020-12 Issue: Volume:846 Page:156488
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Lee Chaerin,Kim Youjung,Kim Rosa,Yoo Bongyoung,Kim Jin-Kyung

Funder

National Research Foundation of Kore

Ministry of Science, ICT & Future Planning

Ministry of Trade, Industry & Energy

KSR

Development of materials and process technology for highly luminance micro

MOTIE

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference34 articles.

1. Copper interconnection integration and reliability;Hu;Thin Solid Films,1995

2. Copper On-Chip Interconnections A Breakthrough in Electrodeposition to Make Better Chips;Andricacos,1999

3. X-ray diffraction investigation of self-annealing in nanocrystalline copper electrodeposits;Pantleon;Scripta Mater.,2006

4. Self-annealing of electrochemically deposited copper films in advanced interconnect applications;Ritzdorf;Proceedings of the IEEE 1998 International Interconnect Technology Conference,1998

5. Two-step room temperature grain growth in electroplated copper;Brongersma;J. Appl. Phys.,1999

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