Application of electroless Ni–Zn–P film for under-bump metallization on solder joint
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference30 articles.
1. Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
2. http://pb.izm.fhg.de.
3. Electrolessly deposited diffusion barriers for microelectronics
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5. Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
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1. Structure and fatigue behavior of electroless plated Ni-Zn-P films using pretreatments, annealing and an applied magnetic field;International Journal of Fatigue;2023-02
2. Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging;Journal of Materials Science: Materials in Electronics;2021-07-16
3. Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding;Journal of Materials Research;2020-08-13
4. Highly solderability of FeP film in contact with SnAgCu solder;Journal of Alloys and Compounds;2020-03
5. Ultrasonic-assisted Ni–Mo–P doping hydrothermal synthesis of clustered spherical MoS2 composite coating: wear and corrosion resistance;Surface Engineering;2020-02-16
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