Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference19 articles.
1. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
2. Progress in the design of new lead-free solder alloys
3. Developing lead-free solders: A challenge and opportunity
4. Lead (Pb)-free solders for electronic packaging
5. Converting to lead-free solders: An automotive industry perspective
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