An improved relation for the effective elastic compliance of a film/substrate system during indentation by a flat cylindrical punch
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference11 articles.
1. Mechanical properties of thin films
2. Measurement of Thin Film Mechanical Properties Using Nanoindentation
3. Elastic analysis of some punch problems for a layered medium
4. The effect of substrate on the elastic properties of films determined by the indentation test — axisymmetric boussinesq problem
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4. The effect of contact aspect ratio and film to substrate elastic modulus ratio on stress vs. strain up to the point of yield during flat punch thin film indentation of an elastic-plastic film;Frontiers in Materials;2022-10-13
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