Author:
Numajiri K.,Goya T.,Tobe R.,Okada O.,Hosokawa N.,Mu C.,Cox N.,Scott C.,Yu J.
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
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2. Proc. 10th Int. VLSI Multilevel Interconnection Conf.;Misawa,1993
3. Enhanced Chemical Vapor Deposition of Copper from ( hfac ) Cu ( TMVS ) Using Liquid Coinjection of TMVS
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