Enhanced Chemical Vapor Deposition of Copper from ( hfac ) Cu ( TMVS ) Using Liquid Coinjection of TMVS-Reference-Cited by-同舟云学术

Enhanced Chemical Vapor Deposition of Copper from ( hfac ) Cu ( TMVS ) Using Liquid Coinjection of TMVS

Published:1995-03-01 Issue:3 Volume:142 Page:939-944
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Petersen Gary A.¹²³,Parmeter John E.¹²³,Apblett Chris A.¹²³,Gonzales Manuel F.¹²³,Smith Paul Martin¹²³,Omstead Thomas R.¹²³,Norman John A. T.¹²³

Affiliation:

1. Sandia National Laboratories, Albuquerque, New Mexico 87185‐5800

2. CVC Products, Incorporated, Rochester, New York 14603‐1866

3. Schumacher, Incorporated, Carlsbad, California 92009

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2048562/pdf

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