Effects of Preparation Methods for Cu Foil on the Electric‐Explosion Properties
Author:
Affiliation:
1. School of Chemistry and Chemical Engineering Southwest Petroleum University Chengdu 610500 Sichuan
2. Institute of Chemical Materials China Academy of Engineering Physics Mianyang 621900 Sichuan
Publisher
Wiley
Subject
General Chemical Engineering,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/prep.202000156
Reference29 articles.
1. Corrosion behaviour of nanocrystalline copper foil in sodium hydroxide solution
2. Method for Al thin film surface nanostructuring using Al imprinting and anodic oxidation: Application to a high capacitance density metal-insulator-metal capacitor
3. Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating
4. High-rate deposition of high-quality Cu film with LPCVD
5. Surface structural features and optical analysis of nanostructured Cu-oxide thin film coatings coated via the sol-gel dip coating method
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