Evaluation of Ti and TiN thicknesses for tungsten plug contact metallization
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference5 articles.
1. Integrated Chemical Vapor Deposition and Plasma Etchback of Tungsten in a Multichamber, Single‐Wafer System
2. Tungsten plug formation by an optimized tungsten etch back process in non-fully planarized topology
3. Chemical Vapor Deposition of Tungsten (CVD W) as Submicron Interconnection and Via Stud
4. Performance and failure mechanisms of TiN diffusion barrier layers in submicron devices
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4. Effect of Silane Flowing Time on W Volcano and Plug Formation;Japanese Journal of Applied Physics;2002-05-15
5. Effects of Barrier-Metal Schemes of Tungsten Plugs and Blanket Film Deposition;Japanese Journal of Applied Physics;2000-08-15
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