Author:
Meinel B.,Langner T.,Preis P.,Sieber T.,Wefringhaus E.,Acker J.
Subject
General Materials Science,Renewable Energy, Sustainability and the Environment
Reference17 articles.
1. Saw damage as an etch mask for the acidic texturization of multicrystalline silicon wafers;Acker;Mater. Sci. Semicond. Process.,2018
2. The impact of lattice strain on the reactivity of silicon;Acker,2018
3. HF/HNO3 etching of the saw damage;Acker;Energy Procedia,2013
4. Surface orientation characterisation of rough mc-silicon surfaces by confocal microscopy and EBSD;Behm;Surf. Interface Anal.,2013
5. Wafer Sawing Process: From Microscopic Phenomena to Macroscopic Properties;Bidiville,2010
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