Lattice strain enhanced acidic etching on as cut sawn silicon wafer-Reference-Cited by-同舟云学术

Lattice strain enhanced acidic etching on as cut sawn silicon wafer

Published:2021-03 Issue: Volume:123 Page:105575
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Herold Steven^ORCID,Acker Jörg

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference41 articles.

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3. Saw damage as an etch mask for the acidic texturization of multicrystalline silicon wafers;Acker;Mater. Sci. Semicond. Process.,2018

4. A two-step acidic texturization procedure for the manufacture of low-reflective multi-crystalline silicon solar wafer;Meinel;Sol. Energy,2019

5. Measurements and significance of roughness inhomogeneity on as-Cut and isotextured wafers;Wefringhaus;Proceedings of the 28th European Photovoltaic Solar Energy Conference and Exhibition,2013

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