Author:
Hsieh Hsin-Hsin,Lin Fu-Ming,Yu Shan-Pu
Subject
Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Tensile behavior of Pb–Sn solder/Cu joints;Quan;J. Electron. Mater.,1987
2. Constant strain rate tensile properties of various lead based solder alloys at 0, 50 and 100°C;Cole;Scr. Metall. Mater.,1992
3. The role of Cu–Sn intermetallics in wettability degradation;Reynolds;J. Eletron. Mater.,1995
4. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys;Frear;Metall. Mater. Trans.,1994
5. Directive 2002/95/ec of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment EC, 2003.
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献