Structure Integrity Analysis on Nickel–Diamond Blade in Dicing of Hard-brittle Ceramic Die
Author:
Funder
Universiti Malaysia Pahang
Publisher
Elsevier BV
Subject
General Medicine
Reference9 articles.
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2. Dicing of hard and brittle materials with on-machine laser-dressed metal-bonded diamond blades;Witzendorff;Precision Eng.,2014
3. Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers;Yuan;Proc. of the Inst. of Mech. Eng., Part B: J. of Eng. Man.,2019
4. Precision dicing of hard materials with abrasive blade;Araujo;Int. J of Adv. Man. Tech.,2016
5. Investigation of chipping and wear of silicon wafer dicing;Lin;J. of Man. Pro.,2016
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