Investigation of chipping and wear of silicon wafer dicing
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference10 articles.
1. Optimizing the wafer dicing process;Efrat,1993
2. Studies of chipping mechanism for dicing silicon wafers;Wang;Int J Adv Manuf Technol,2008
3. Phase transformations in silicon under dry and lubricated sliding;Kovalchenko;Tribol Trans,2002
4. Prediction of steady-state wear coefficients in adhesive wear;Yang;Tribol Trans,2004
5. A test methodology for the determination of wear coefficient;Yang;Wear,2005
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