In-situ CMP Endpoint Detection Using Acoustic Emission-Reference-Cited by-同舟云学术

In-situ CMP Endpoint Detection Using Acoustic Emission

Published:2014 Issue: Volume:14 Page:454-459
ISSN:2212-8271
Container-title:Procedia CIRP
language:en
Short-container-title:Procedia CIRP

Author:

Helu Moneer,Chien Joshua,Dornfeld David

Publisher

Elsevier BV

Subject

General Medicine

Reference16 articles.

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2. Chien JM. Acoustic emission signal characterization for in-situ process monitoring during chemical mechanical planarization. MS Thesis, University of California, Berkeley, 2006.

3. Steigerwald JM, Murarka SP, Gutmann RJ. Chemical mechanical planarization of microelectronic materials. New York: Wiley; 1997.

4. Hocheng H, Huang YL. A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing. Intl J Material and Product Tech 2003; 18(4/5/6):469-86.

5. Bibby T, Holland K. Endpoint detection for CMP. J Electronic Materials 1998;27(10):1073-81.

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