Simple bond energy approach for non-destructive measurements of the fracture toughness of brittle materials
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference125 articles.
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2. Integration challenges of porous ultra low-k spin-on dielectrics
3. Mechanical properties of thin films
4. Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures
5. Determination of the hardness and elastic modulus of low-k thin films and their barrier layer for microelectronic applications
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