An electroplating method for copper plane twin boundary manufacturing-Reference-Cited by-同舟云学术

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An electroplating method for copper plane twin boundary manufacturing

Published:2013-10 Issue: Volume:544 Page:157-161
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Wang Yu-Sheng,Lee Wen-Hsi,Chang Shih-Chieh,Nian Jun-Nan,Wang Ying-Lang

Funder

National Cheng Kung University, Tainan, Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Electromigration path in Cu thin-film lines

2. Microtexture and electromigration-induced drift in electroplated damascene Cu

3. Copper interconnections and reliability

4. Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

5. Electromigration in Cu(Al) and Cu(Mn) damascene lines

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2. Reusable self-floating carriers recover heavy metals from industrial wastewater through heterogeneous nucleation for resource reuse;Journal of Hazardous Materials;2023-04

3. Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler;Journal of Materials Science: Materials in Electronics;2022-08

4. Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations;Journal of The Electrochemical Society;2020-05-20

5. Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship;Microelectronics Reliability;2019-05

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