A numerical study on the effect of mobilities and initial profile in thin film morphology evolution
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
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2. Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion in a gradient stress field and an electric field;Journal of Mechanics of Materials and Structures;2018-08-31
3. Dynamics of faceted thin films formation during vapor deposition;Materials Research Express;2018-01-08
4. A finite-element analysis of in-grain microcracks caused by surface diffusion induced by electromigration;International Journal of Solids and Structures;2015-06
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