Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference37 articles.
1. Current-induced marker motion in gold wires
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4. Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences
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