Interaction between abrasive particles and films during chemical-mechanical polishing of copper and tantalum-Reference-Cited by-同舟云学术

Interaction between abrasive particles and films during chemical-mechanical polishing of copper and tantalum

Published:2006-02 Issue:1-2 Volume:497 Page:321-328
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Li Ying,Zhao Junzi,Wu Ping,Lin Yong,Babu S.V.,Li Yuzhuo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference28 articles.

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