The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation

Published:2008-04 Issue:12 Volume:516 Page:3761-3766
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Kang Moo Seong,Kim Soo-Kil,Kim Keeho,Kim Jae Jeong

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Damascene copper electroplating for chip interconnections

2. Twelfth International VLSI Multilevel Interconnection Conference, Santa Clara, CA, USA, June 27–29, 1995, Proceedings VMIC;Contolini,1995

3. Copper metallization for ULSL and beyond

4. Copper Deposition in the Presence of Polyethylene Glycol: I. Quartz Crystal Microbalance Study

5. Copper Deposition in the Presence of Polyethylene Glycol: II. Electrochemical Impedance Spectroscopy

Cited by 65 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem;Journal of Electroanalytical Chemistry;2024-11

2. Roles and influencing mechanisms of Fe2+ and Lix984 in copper electrodeposition;Ionics;2024-09-03

3. Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method;Materials Characterization;2024-09

4. Enhanced interface structure of electroformed copper/diamond composites for thermal management applications;Materials Testing;2024-01-29

5. Preparation of Nano Twin Copper Foil with High Elongation and Excellent Suppression Self-Annealing Via Pulse Superposition Direct Current Method;2024

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3