Application of NiMoNb adhesion layer on plasma-treated polyimide substrate for flexible electronic devices-Reference-Cited by-同舟云学术

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Application of NiMoNb adhesion layer on plasma-treated polyimide substrate for flexible electronic devices

Published:2014-05 Issue: Volume:558 Page:405-410
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Bang S.-H.,Kim K.-K.,Jung H.-Y.,Kim T.-H.,Jeon S.-H.,Seol Jae-Bok

Funder

Metal & Material Technology, LS-Mtron (Korea).

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits;Noh;Microelectron. Eng.,2011

2. Bendable Single Crystal. Silicon Thin Film Transistors Formed by Printing on Plastic Substrates;Menard;Appl. Phys. Lett.,2005

3. High electron mobility transistors on plastic flexible substrates;Chen;Appl. Phys. Lett.,2011

4. Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate;Eom;Thin Solid Films,2008

5. Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer;Noh;Int. J. Adhes. Adhes.,2010

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1. Direct bonding of copper foil and liquid crystal polymer by laser etching and welding;Optics and Lasers in Engineering;2021-04

2. Photoluminescence, thermal and surface properties of triarylimidazole-containing polyimide nanocomposite films;RSC Advances;2021

3. Research on temperature-assisted laser transmission welding of copper foil and polyethylene terephthalate;Journal of Manufacturing Processes;2020-09

4. Damage-free polymer surface modification employing inward-type plasma;Japanese Journal of Applied Physics;2017-07-20

5. Electrical properties of transferred graphene films on pre-treated polyimide substrate by inductively coupled plasma;Carbon;2016-11

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