Author:
Ikeda Akihiro,Sakamoto Atsushi,Hattori Reiji,Kuroki Yukinori
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. 57th Electronic Components and Technology Conference, Nevada, U.S.A., May 29-June 1, Conference Proceedings;Schaper,2007
2. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
3. Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology
4. 57th Electronic Components and Technology Conference, Nevada, U.S.A., May 29-June 1, Conference Proceedings;Tezcan,2007
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