Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Author:

Song Xu,Yeap Kong Boon,Zhu Jing,Belnoue Jonathan,Sebastiani Marco,Bemporad Edoardo,Zeng Kaiyang,Korsunsky Alexander M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

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3. Packaging Induced Stresses in Embedded and Molded GaN Power Electronics Components;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

4. Novel Approach for Assessing Cyclic Thermomechanical Behavior of Multilayered Structures;Advanced Engineering Materials;2022-12-07

5. Incremental FIB-DIC Ring-Core Methods for the Residual Stress Measurement of Bilayer Thin Films;Experimental Mechanics;2022-07-07

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