A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS-Reference-Cited by-同舟云学术

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A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Published:2001-03 Issue:1 Volume:10 Page:69-79
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Shih C.-L.,Lai B.-K.,Kahn H.,Phillips S.M.,Heuer A.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/19662/00911094.pdf?arnumber=911094

Cited by 74 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Ni-Ti Akıllı Alaşım İnce Filmin Sıcaklığa Bağlı X-Ray Kırınımı ile Karakterizasyonu ve Faz Dönüşümü Tespiti;Bilecik Şeyh Edebali Üniversitesi Fen Bilimleri Dergisi;2019-09-02

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