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Electron backscatter diffraction characterization of electrolytic Cu deposition in the blind-hole structure: Current density effect

  • Published:2015-06 Issue: Volume:584 Page:78-84
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Ho C.E.,Chen C.C.,Hsu L.H.,Lu M.K.

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference37 articles.

1. Printed Circuit Boards: Design, Fabrication, Assembly and Testing;Khandpur,2006

2. Damascene copper electroplating for chip interconnections;Andricacos;IBM J. Res. Dev.,1998

3. Via-filling using electroplating for build-up PCBs;Kobayashi;Electrochim. Acta,2001

4. Filling mechanism in microvia metallization by copper electroplating;Dow;Electrochim. Acta,2008

5. Effects of current density and deposition time on electrical resistivity of electroplated Cu layers;Lin;J. Mater. Sci. Mater. Elec.,2004

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