Material removal efficiency improvement by orientation control of CMP pad surface asperities
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference16 articles.
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2. Advances in chemical mechanical planarization (CMP);Babu,2016
3. Scratching by pad asperities in chemical–mechanical polishing;Saka;CIRP Annals,2010
4. Optimization of the physical cleaning condition for nanotechnology;Shin;CIRP Annals,2011
5. Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier;Suzuki;CIRP Annals,2017
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