Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference33 articles.
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3. Transmission electron microscopy of nanomachined silicon crystals;Puttick;Philos. Mag. A,1994
4. Effect of ultraprecision grinding on the microstructural change in silicon monocrystals;Zarudi;J. Mater. Process. Technol.,1998
5. Measurement of subsurface damage in silicon wafers;Bismayer;Prec. Eng.,1994
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