Measurement of subsurface damage in silicon wafers-Reference-Cited by-同舟云学术

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Measurement of subsurface damage in silicon wafers

Published:1994-04 Issue:2 Volume:16 Page:139-144
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Bismayer U.,Brinksmeier E.,Güttler B.,Seibt H.,Menz C.

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Mechanische Kristallbearbeitung;Hadamovsky,1985

2. Structure of the surface layers of molybdenum single crystals after machining;Gert;Physics Chem Mech Surface,1984

3. Abrasive machining of silicon;Tönschoff;Ann CIRP,1990

4. Werkzeugbeanspruchung beim Innendurchmesser-Trenn-schleifen;v. Schmieden,1990

5. Research and Development;Lundt,1992

Cited by 42 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Detecting subsurface damage within glasses with polarization-sensitive optical coherence tomography;Optics & Laser Technology;2024-10

2. Experimental investigation of Aluminum Nitride ceramics based on compliant finishing process;Journal of Manufacturing Processes;2024-09

3. Quantification of microstructural homogeneity in indium arsenide epilayers by X-ray diffraction;Metrology and Measurement Systems;2024-08-19

4. Detection of Subsurface Damage Morphology of Lapped Optical Components by Analysis of the Fluorescence Lifetimes of Quantum Dots;Electronics;2023-09-13

5. Detecting Subsurface Damage within Glasses with Polarization-Sensitive Optical Coherence Tomography;2023

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