Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference36 articles.
1. Chemical and mechanical balance in polishing of electronic materials for defect-free surfaces;Lee;CIRP Annals-Manufacturing Technology,2009
2. Chemical mechanical planarization for microelectronics applications;Zantye;Materials Science and Engineering R,2004
3. Chemical mechanical planarization of microelectronic materials;Steigerwald,1997
4. Mechanical effect of colloidal silica in copper chemical mechanical planarization;Lee;Journal of Materials Processing Technology,2009
5. Probable role of abrasion in chemo-mechanical polishing of tungsten;Larsen-Basse;Wear,1999
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