Examination of internal stress by photoelasticity in laser cleaving of glass
Author:
Funder
Japan Society for the Promotion of Science
Publisher
Elsevier BV
Subject
General Engineering
Reference32 articles.
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3. Precision breaking of a liquid crystal display panel (STN type) by YAG laser;Kurobe;J Jpn Soc Precis Eng,1997
4. Breaking of silicon wafer by irradiation of YAG laser;Kurobe;J Soc Mater Sci Jpn,1995
5. Laser cleaving of sapphire wafer with pulsed CO2 laser;Ueda;J Jpn Soc Abrasive Technol,2011
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