Study on Laser Cleaving of Brittle Materials with Two-Types Laser Beam (Precise Cleaving of the Thick Glass Materials with CO<sub>2</sub> Laser and Er:YAG Laser)-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Study on Laser Cleaving of Brittle Materials with Two-Types Laser Beam (Precise Cleaving of the Thick Glass Materials with CO₂ Laser and Er:YAG Laser)

Published:2012 Issue:788 Volume:78 Page:1295-1304
ISSN:0387-5024
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
language:en
Short-container-title:Trans.JSME(C)

Author:

UEDA Takashi¹,FURUMOTO Tatsuaki¹,HOSOKAWA Akira¹,TANAKA Ryutaro¹

Affiliation:

1. Institute of Science and Engineering, Kanazawa Univ.

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Link

https://www.jstage.jst.go.jp/article/kikaic/78/788/78_788_1295/_pdf

Reference15 articles.

1. (2) Fukuto, F., Fukumitsu, K. and Uchiyama, N., “The Stealth Dicing Technologies and Their Application”, Proceedings of the 6th Laser Precision Microfabrication, (2005).

2. (3) 木下純一,川田義高,"レーザスクライビング,パターニング技術の変遷",レーザ加工学会誌,Vol. 16 No. 2 (2009), pp.110-114.

3. (4) Ueda, T., Yamada, K., Oiso, K., and Hosokawa, A., “Thermal Stress Cleaving of Brittle Materials by Laser Beam”, Annals of the CIRP, Vol. 51, No. 1 (2002), pp.149-152.

4. Breaking of Silicon Wafer by Irradiation of YAG Laser.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Examination of internal stress by photoelasticity in laser cleaving of glass;Precision Engineering;2020-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP