A calculation method for workpiece profile variation during double-sided lapping by considering workpiece elastic deformation
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference19 articles.
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2. Theoretical and experimental analysis for the surface shape evolution of ultrathin workpiece considering the pad surface shape in double-sided polishing;Materials Science in Semiconductor Processing;2024-01
3. Effect of the vibration displacement responses on end grinding processed surface height;The International Journal of Advanced Manufacturing Technology;2023-11-28
4. Development of a Control System for a Vibratory Lapping-Polishing Machine;2023 IEEE XXVIII International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED);2023-09-11
5. Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC);Micromachines;2023-05-26
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