1. Interconnect-power dissipation in a microprocessor;Magen,2004
2. Three-dimensional Integrated Circuit Design;Pavlidis,2009
3. Three Dimensional System Integration: IC Stacking Process and Design;Papanikolaou,2010
4. 3-D FPGA from tezzaron.
5. Xilinx stacked silicon interconnect technology delivers breakthrough FPGA capacity, bandwidth, and power efficiency, 2010.