Cu/SiO2 hybrid bonding obtained by surface-activated bonding method at room temperature using Si ultrathin films-Reference-Cited by-同舟云学术

Cu/SiO2 hybrid bonding obtained by surface-activated bonding method at room temperature using Si ultrathin films

Published:2019-03 Issue: Volume:2 Page:1-6
ISSN:2590-0072
Container-title:Micro and Nano Engineering
language:en
Short-container-title:Micro and Nano Engineering

Author:

Utsumi Jun,Ide Kensuke,Ichiyanagi Yuko

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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