Etch mechanism of an Al2O3 hard mask in the Bosch process-Reference-Cited by-同舟云学术

Etch mechanism of an Al2O3 hard mask in the Bosch process

Published:2022-04 Issue: Volume:14 Page:100102
ISSN:2590-0072
Container-title:Micro and Nano Engineering
language:en
Short-container-title:Micro and Nano Engineering

Author:

Drost Martin,Marschmeyer Steffen,Fraschke Mirko,Fursenko Oksana,Bärwolf Florian,Costina Ioan,Mahadevaiah Mamathamba Kalishettyhalli,Lisker Marco

Funder

Bundesministerium für Bildung und Forschung

Bundesministerium fur Bildung und Forschung Dienststelle Berlin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

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5. Silicon Deep Reactive Ion Etching with aluminum hard mask;Bagolini;Mater. Res. Express,2019

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