Effects of the strain rate in compression of electrodeposited gold micro-pillars toward the design of MEMS components-Reference-Cited by-同舟云学术

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Effects of the strain rate in compression of electrodeposited gold micro-pillars toward the design of MEMS components

Published:2024-06 Issue: Volume:23 Page:100254
ISSN:2590-0072
Container-title:Micro and Nano Engineering
language:en
Short-container-title:Micro and Nano Engineering

Author:

Kanno Shota,Omura Taro,Wu Jhen-Yang,Kurioka Tomoyuki,Chen Chun-Yi,Chakraborty Parthojit,Machida Katsuyuki,Ito Hiroyuki,Miyake Yoshihiro,Sone Masato,Chang Tso-Fu Mark

Funder

Japan Science and Technology Agency

Core Research for Evolutional Science and Technology

Publisher

Elsevier BV

Reference26 articles.

1. Design of sub-1 g microelectromechanical systems accelerometer;Yamane;Appl. Phys. Lett.,2014

2. Investigation of metal interconnect for wafer-level and sealable miniaturized MEMS encapsulation;Tsai;IEEE Trans. Electron Dev.,2021

3. Miniaturization of optical spectrometers;Yang;Science,2021

4. CMOS-MEMS based microgravity sensor and its application;Masu;ECS Trans.,2020

5. Integrated CMOS-MEMS technology and its applications;Machida;ECS Trans.,2014

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