Computational modeling techniques for reliability of electronic components on printed circuit boards-Reference-Cited by-同舟云学术

Computational modeling techniques for reliability of electronic components on printed circuit boards

Published:2002-01 Issue:1-2 Volume:40 Page:101-117
ISSN:0168-9274
Container-title:Applied Numerical Mathematics
language:en
Short-container-title:Applied Numerical Mathematics

Author:

Bailey C.,Lu H.,Wheeler D.

Publisher

Elsevier BV

Subject

Applied Mathematics,Computational Mathematics,Numerical Analysis

Reference15 articles.

1. Multiphysics modeling of the metals casting processes;Bailey;Proc. Roy. Soc. London Ser. A,1996

2. Numerical modeling of solder joint formation;Bailey;Soldering and Surface Mount Technology,1998

3. S. Bounds, G. Moran, K. Pericleous, M. Cross, Finite volume modeling of shrinkage porosity formation in metals casting, in: Modeling of Casting, Welding and Adv. Solidification Processes VIII, TMS, Warrendale, PA, 1998, pp. 857–864

4. Computational issues in the modeling of materials-based manufacturing processes;Cross;J. Comput. Aided Materials Design,1996

5. Reliability of PBGA Assembly;Darveaux,1995

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