Numerical modelling of solder joint formation-Reference-Cited by-同舟云学术

Numerical modelling of solder joint formation

Published:1998-08 Issue:2 Volume:10 Page:6-13
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Bailey Chris,Wheeler Daniel,Cross Mark

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Multiphysics modelling of the metals casting process

2. Bailey, C., Wheeler, D. and Cross, M. (1997, “Multiphysics simulations for solder joints formation”,ASME, EEP, Vol. 19 No. 2,Advances in Electronic Packaging, pp. 1413‐20.

3. The Surface Evolver

4. Computational issues in the modelling of materials-based manufacturing processes

5. Cross, M.et al. (1996), “Physica ‐ a software environment for the modelling of multiphysics phenomena”,ZAMM, Vol. 76, pp. 101‐04.

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