Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics-Reference-Cited by-同舟云学术

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Published:2021-04-19 Issue: Volume: Page:
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Container-title:2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Schipfer Christian,Gschwandl Mario,Fuchs Peter,Antretter Thomas,Feuchter Michael,Morak Matthias,Tao Qi,Schingale Angelika

Publisher

IEEE

Link

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