Plastic ball grid array (PBGA) overview-Reference-Cited by-同舟云学术

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Plastic ball grid array (PBGA) overview

Published:1995-05 Issue:4 Volume:40 Page:236-244
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Liu Jay J.,Berg Howard,Wen Yenting,Mulgaonker Shailesh,Bowlby Reed,Mawer Andrew

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference13 articles.

1. Over-molded plastic pad array carriers (OMPAC);Freyman,1991

2. Compaq, Motorola lead US drive for BGA packages;Fukuda;Nikkei Electronics Asia,1994

3. Electrical performance on an overmolded pad array carrier (OMPAC);Yip,1994

4. Ball Grid Array Technology;Lee,1995

5. Thermal characterization of 313 pin ball grid array packages;Johnson,1995

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2. Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

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4. Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure;Ceramics International;2023-08

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