An Improved Automated SPI Data Analysis Report Generator for Printed Circuit Board Assembly-Reference-Cited by-同舟云学术

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An Improved Automated SPI Data Analysis Report Generator for Printed Circuit Board Assembly

Published:2024-01-29 Issue: Volume: Page:1-7
ISSN:
Container-title:2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)
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Author:

Alshraida Hamzeh¹,Santos Daryl¹,Lee Joseph²,Dabous Iman³,Aguilar Talbert³,Hubble Neil⁴

Affiliation:

1. Watson Institute for Systems Excellence (WISE), Binghamton University - State University of New York (SUNY),Systems Science and Industrial Engineering Department,NY,USA

2. FOXCONN Industrial Internet (FII),CA,USA

3. NVIDIA,CA,USA

4. AKROMETRIX,GA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10436504/10436439/10436509.pdf?arnumber=10436509

Reference9 articles.

1. Warpage measurement of substrates and printed circuit boards with Shadow Moiré

2. Stencil Design Guidelines (IPC-7525A),2003

3. Surface Mount Technology

4. Plastic ball grid array (PBGA) overview

5. Machine learning benchmarks and random forest regression;Segal,2004

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