Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices-Reference-Cited by-同舟云学术

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Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices

Published:2017-07 Issue: Volume:85 Page:119-131
ISSN:0894-1777
Container-title:Experimental Thermal and Fluid Science
language:en
Short-container-title:Experimental Thermal and Fluid Science

Author:

Ji Xianbing,Li Hongchuan,Xu Jinliang,Huang Yanping

Funder

National Natural Science Foundation of China

Key Project of Natural Science Foundation of China

Foundation of CNNC Key Laboratory on Nuclear Reactor Thermal Hydraulics Technology

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Aerospace Engineering,Nuclear Energy and Engineering,General Chemical Engineering

Reference38 articles.

1. Heat pipes for cooling high flux/high power semiconductor chips;North;ASME J. Elect. Pack.,1993

2. The development of polymer-based flat heat pipes;Oshman;J. Microelectromech. Syst.,2011

3. The length and bending angle effects on the cooling performance of flat plate heat pipes;Chen;Int. J. Heat Mass Transfer,2015

4. Micro and miniature heat pipes-electronic component coolers;Vasiliev;Appl. Therm. Eng.,2008

5. Integrated thermal management techniques for high power electronic devices;McGlen;Appl. Therm. Eng.,2004

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