Flow in a microchannel filled with arrays of numerous pillars-Reference-Cited by-同舟云学术

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Flow in a microchannel filled with arrays of numerous pillars

Published:2022-10 Issue: Volume:97 Page:109045
ISSN:0142-727X
Container-title:International Journal of Heat and Fluid Flow
language:en
Short-container-title:International Journal of Heat and Fluid Flow

Author:

Gräfner S.J.,Wu P.Y.,Kao C.R.

Funder

Ministry of Science and Technology, Taiwan

National Taiwan University

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference26 articles.

1. Partial Differential Equations with Fourier Series and Boundary Value Problems;Asmar,2016

2. Pressure drop of fully-developed, laminar flow in microchannels of arbitrary cross-section;Bahrami;J. Fluids Eng. Trans. ASME,2006

3. Theoretical Microfluidics, Vol. 18;Bruus,2007

4. Pillar based microfluidic approach to sorting of microparticle mixtures at various particle ratios;Chandna;Microfluid. Nanofluid.,2021

5. Introduction to COMSOL Multiphysics V.4.2a;COMSOL Multiphysics,2011

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling considerations about a microchannel heat sink;Physics of Fluids;2024-08-01

2. Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study;Advanced Materials;2023-11-08

3. Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications;Chemical Engineering Science;2023-04

4. Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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